Electrophoretic display with thermal control

ABSTRACT

An electrophoretic display (EPD) with thermal control is disclosed for controlling and maintaining an image in extreme temperature environments. Techniques are also disclosed for maintaining the EPD cell threshold voltage for EPD cells comprising an EPD display media at or above a desired level in an environment in which the EPD may be subjected to an extreme temperature. The techniques comprise sensing a sensed temperature associated with the EPD display media, determining whether the sensed temperature satisfies a criterion established to ensure that the display media temperature remains at a level associated with an acceptable EPD cell threshold voltage, and in the event it is determined that the sensed temperature does not satisfy the criterion, controlling the EPD display media temperature as required to bring the sensed temperature to a level that satisfies the criterion.

This application is a continuation-in-part of U.S. application Ser. No.11/414,635, filed on Apr. 27, 2006; which is a divisional application ofU.S. application Ser. No. 10/956,367 filed on Oct. 1, 2004, now U.S.Pat. No. 7,061,662; which claims the benefit of U.S. ProvisionalApplication No. 60/509,401 filed on Oct. 7, 2003; the entire contents ofall the above-identified applications are incorporated herein byreference in their entirety.

RELATED APPLICATIONS

Both U.S. Provisional Patent Application No. 60/505,340, entitled“Passive Matrix Electrophoretic Display Driving Scheme,” filed May 16,2003; and co-pending U.S. Patent Application Publication No. US2004-0246562, entitled “Passive Matrix Electrophoretic Display DrivingScheme,” filed Apr. 30, 2004; are incorporated herein by reference intheir entirety.

FIELD OF INVENTION

The present invention relates generally to display devices. Morespecifically, an electrophoretic display with thermal control isdisclosed.

BACKGROUND OF THE INVENTION

The electrophoretic display (EPD) is a non-emissive device based on theelectrophoresis phenomenon of charged pigment particles suspended in asolvent. The EPD was first proposed in 1969. The display usuallycomprises two plates with electrodes placed opposing each other,separated by spacers. One of the electrodes is usually transparent. Asuspension composed of a colored solvent and charged pigment particlesis enclosed between the two plates. When a voltage difference is imposedbetween the two electrodes, the pigment particles migrate to one sideand then either the color of the pigment or the color of the solvent canbe seen according to the polarity of the voltage difference.

There are several different types of EPDs. In the partition type EPD(see M. A. Hopper and V. Novotny, IEEE Trans. Electr. Dev., Vol. ED 26,No. 8, pp. 1148-1152 (1979)), there are partitions between the twoelectrodes for dividing the space into smaller cells in order to preventundesired movements of particles such as sedimentation. The microcapsuletype EPD (as described in U.S. Pat. No. 5,961,804 and U.S. Pat. No.5,930,026) has a substantially two dimensional arrangement ofmicrocapsules each having therein an electrophoretic composition of adielectric fluid and a suspension of charged pigment particles thatvisually contrast with the dielectric solvent. Another type of EPD (seeU.S. Pat. No. 3,612,758) has electrophoretic cells that are formed fromparallel line reservoirs. The channel-like electrophoretic cells arecovered with, and in electrical contact with, transparent conductors. Alayer of transparent glass from which side the panel is viewed overliesthe transparent conductors.

An improved EPD technology was disclosed in co-pending applications,U.S. patent Ser. No. 09/518,488, filed on Mar. 3, 2000, U.S. patent Ser.No. 09/759,212, filed on Jan. 11, 2001, U.S. patent Ser. No. 09/606,654,filed on Jun. 28, 2000 and U.S. patent Ser. No. 09/784,972, filed onFeb. 15, 2001, all of which are incorporated herein by reference. TheEPD comprises closed cells formed from microcups of well-defined shape,size and aspect ratio and filled with charged pigment particlesdispersed in a dielectric solvent.

FIG. 1 illustrates a typical EPD cell 100 comprising a quantity ofelectrophoretic dispersion 102, the dispersion comprising a plurality ofcharged pigment particles 104 dispersed in a colored dielectric solvent106. The dispersion 102 is contained by a top layer of insulatingmaterial 108 and a bottom layer of insulating material 110. In oneembodiment, the insulating material may comprise a non-conductivepolymer. In the cells described in the above-incorporated co-pendingpatent applications, the insulating layer may comprise a sealing and/oradhesive layer, or the microcup structure. The dispersion and associatedinsulating materials are positioned between an upper electrode 112 and alower electrode 114.

An EPD may be driven by a passive matrix system. For a typical passivematrix system, there are column electrodes on the top side (viewingsurface) of the display and row electrodes on the bottom side of thecells (or vice versa). The row electrodes and the column electrodes areperpendicular to each other.

Cross bias is a well-known problem for a passive matrix display. Thevoltage applied to a column electrode not only provides the driving biasfor the cell on the scanning row, but it also affects the bias acrossthe non-scanning cells on the same column. This undesired bias may forcethe particles of a non-scanning cell to migrate to the oppositeelectrode. This undesired particle migration causes visible opticaldensity change and reduces the contrast ratio of the display.

Conventional EPD devices, such as those described in U.S. PatentApplication No. 60/417,762 filed Oct. 10, 2002, which is incorporatedherein by reference, are sensitive to environments where temperatureranges may be extreme such as an outdoor environment. When an EPD isused in an outdoor environment, it may experience temperature extremesrising to more than 80° C. or less than −20° C. When the environmentaltemperature exceeds 60° C. or falls below 0° C., the performance of aconventional EPD can degrade quickly. Although conventional EPDs maywork well in controlled, moderate indoor environments, the outdoortemperature extremes can affect the threshold effect exhibited by EPDcells such as those described in the '762 application.

Heating devices are used in display systems to control temperatures inextreme environments. A heating device for a flat panel display shouldbe thin, compact, and light in weight. Typically micro-wire and thinfilm heating devices have been used for flat panel displays. Micro-wireheaters exhibit satisfactory transparency and can be applied to theviewing side of a display. However, the costs for micro-wire heaters aregenerally high. The costs for thin film heaters are also high and suchheaters often filter desired light from the display, thus degradingdisplayed images.

Thus, there is a need for an EPD that can adjust for environmentaltemperature extremes such as those found in an outdoor setting. There isalso a need for an EPD that under extreme temperature conditions canmaintain satisfactory EPD performance.

SUMMARY OF THE INVENTION

The present invention is directed to an EPD module structure, comprising(i) an EPD panel comprising EPD cells filled with EPD display media; and(ii) a thermal control pad which is capable of controlling thetemperature associated with the EPD display media to ensure that thethreshold voltage of the EPD cells is equal to or greater than one thirdof a driving voltage used to drive the EPD cells to a desired displaystate. The EPD module structure optionally further comprises a clearfront plate, a metal plate, an air gap, a thermal barrier sheet, or anelectric power source.

BRIEF DESCRIPTION OF THE DRAWINGS

Various embodiments of the invention are disclosed in the followingdetailed description and the accompanying drawings.

FIG. 1 illustrates a typical EPD cell;

FIG. 2 illustrates a top view of a 2×2 passive matrix;

FIGS. 3A-3D illustrates a lateral view of a 2×2 passive matrix;

FIG. 4 is a graph illustrating the relationship between thresholdvoltage and temperature, in accordance with an embodiment of the presentinvention;

FIG. 5A illustrates an EPD module structure with a heating pad inaccordance with an embodiment of the present invention;

FIG. 5B illustrates an EPD module structure with a cooling pad inaccordance with an embodiment of the present invention;

FIG. 5C illustrates an EPD module structure with a thermal control padin accordance with an embodiment of the present invention;

FIG. 6A illustrates a thermal control pad in accordance with anembodiment of the present invention;

FIG. 6B illustrates a thermal control pad in accordance with analternative embodiment of the present invention;

FIG. 7A illustrates a DC voltage 710 applied to an electrode of an EPDin one embodiment;

FIG. 7B illustrates an AC signal 720 applied to an electrode layer inone embodiment to achieve the same effect on the EPD cells as the DCvoltage of FIG. 7A while also generating heat as a product of the ACcurrent passing through the electrode;

FIG. 8A illustrates an EPD thin film heater in accordance with anembodiment;

FIG. 8B illustrates an AC voltage applied to a common electrode of anexemplary EPD thin film heater;

FIG. 8C illustrates an AC voltage applied to an EPD thin film heater;

FIG. 9A illustrates a passive matrix EPD 900 used in one embodiment;

FIG. 9B illustrates a DC voltage 920 that can be applied to non-selectedrows during scanning of EPD 900 in one embodiment;

FIG. 9C illustrates a DC voltage 925 of 30V DC applied to the scanningrow of EPD 900;

FIG. 9D illustrates an AC voltage 930 that can be applied to passivematrix EPD 900;

FIG. 10A is a state diagram illustrating a thermal control algorithm1000 used in one embodiment;

FIG. 10B is a state diagram illustrating a thermal control heatingalgorithm 1010 used in one embodiment;

FIG. 10C is a state diagram 1020 illustrating a thermal control coolingalgorithm 1020 used in one embodiment; and

FIG. 11 illustrates an EPD thermal control system in accordance with anembodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The invention can be implemented in numerous ways, including as aprocess, an apparatus, a system, a composition of matter, a computerreadable medium such as a computer readable storage medium or a computernetwork wherein program instructions are sent over optical or electroniccommunication links. In this specification, these implementations, orany other form that the invention may take, may be referred to astechniques. In general, the order of the steps of disclosed processesmay be altered within the scope of the invention.

A detailed description of one or more embodiments of the invention isprovided below along with accompanying figures that illustrate theprinciples of the invention. The invention is described in connectionwith such embodiments, but the invention is not limited to anyembodiment. The scope of the invention is limited only by the claims andthe invention encompasses numerous alternatives, modifications andequivalents. Numerous specific details are set forth in the followingdescription in order to provide a thorough understanding of theinvention. These details are provided for the purpose of example andinvention may be practiced according to the claims without some or allof these specific details. For the purpose of clarity, technicalmaterial that is known in the technical fields related to the inventionhas not been described in detail so that the invention is notunnecessarily obscured.

The term “threshold voltage” (Vth), in the context of the presentdisclosure, is defined as the maximum bias voltage that does not causethe particles in a cell to move between electrodes. The term “drivingvoltage” (Vd), in the context of the present disclosure, is defined asthe bias voltage applied to change the color state of a cell, such as bydriving the particles in the cell from an initial position at or nearone electrode to an end position at or near the opposite electrode. Thedriving voltage Vd used in a particular application must be sufficientto cause the color state of the cell to change within the requiredperformance parameters of the application, including as measured by suchparameters as the time it takes for the state transition to becompleted.

A “scanning” row in a passive matrix display is a row in the displaythat is currently being updated or refreshed. A “non-scanning” row is arow that is not currently being updated or refreshed. A “positive bias”,in the context of the present disclosure, is defined as a bias thattends to cause positively charged particles to migrate downwards (i.e.,upper electrode at higher potential than lower electrode). A “negativebias”, in the context of the present disclosure, is defined as a biasthat tends to cause positively charged particles to migrate upwards(i.e., lower electrode at higher potential than upper electrode).

For a typical passive-matrix, the row electrodes are on the top, and thecolumn electrodes are on the bottom and perpendicular to the rowelectrodes. FIG. 2 and FIGS. 3A-3D illustrate a 2×2 passive matrix. FIG.2 shows the top view of a general 2×2 passive matrix. In this figure,voltage A drives the top, non-scanning row and voltage B drives thebottom, scanning row.

Initially, as shown in FIGS. 3A-3D, the particles in cells W, Y and Zare at the top of the cells, and the particles in cell X are at thebottom of the cell. Assume the scanning row B is to be modified suchthat the particles in cell Y are moved to the bottom electrode while theparticles in cell Z are to be maintained at their current position atthe top electrode. The particles in the cells of the non-scanning rowshould, of course, remain at their initial positions—W at the topelectrode and X at the bottom electrode—even if a cross-biasingcondition is present.

Because Cells W and X are in a non-scanning row, the goal is to ensurethat the particles remain at the current electrode position even whenthere is a cross bias condition affecting the row. The threshold voltageof the cell is an important factor in these two cases. Unless thethreshold voltage is equal to or greater than the cross bias voltagethat may be present, the particles in these cells will move when such across bias is present, thereby reducing the contrast ratio.

In order to drive the particles in cell Y from the top electrode to thebottom electrode within a specific time period, a driving voltage Vdmust be applied. The driving voltage used in a particular applicationmay be determined by a number of factors, including but not necessarilylimited to cell geometry, cell design, array design and layout, and thematerials and solvents used. In order to move the particles in cell Ywithout affecting the particles in cells W, X and Z, the driving voltageVd applied to change the state of cell Y must also be of a magnitude,and applied in such a way, so as not to result in the remaining cellsbeing cross biased in an amount greater than the threshold voltage Vthof the cells.

To determine the minimum threshold voltage needed to avoid unintendedstate changes in the basic passive matrix illustrated in FIGS. 2 and3A-3D under these conditions, the following inequality conditions shouldbe satisfied:

A−C≦Vth

D−A≦Vth

B−C≧Vd

B−D≦Vth

This system of equations may be solved by summing the three inequalitiesinvolving Vth, to yield the inequality (A−C)+(D−A)+(B−D)≦Vth+Vth+Vth,which simplifies to B−C≦3Vth, or 3Vth≧B−C. Combining this inequalitywith the remaining inequality B−C≧Vd, we conclude that 3Vth≧B−C≧Vd,which yields 3Vth≧Vd or Vth≧⅓ Vd. That is, for the passive matrixillustrated in FIGS. 2 and 3A-3D, the cells must have a thresholdvoltage equal to or greater than one third of the driving voltage to beapplied to change the state of those cells in which a state change isdesired in order to avoid changing as a result of cross bias the stateof those cells in which a state change is not desired. Referring furtherto FIGS. 2 through 3A-3D, if the driving voltage Vd is applied to thescanning row B, then solution of the above inequalities indicates thatto ensure that the driving bias voltage is applied to cells to beprogrammed and that no more than the threshold voltage is applied toother cells (i.e., non-programming cells in the scanning row and allcells in the non-scanning row) the voltage applied to the non-scanningrow A should be equal to ⅓Vd, the voltage applied to the columnelectrode associated with a cell in the scanning row to be programmed(i.e., display state changed), such as column electrode C, should be 0volts, and the voltage applied to the column electrode associated with acell in the scanning row that is not to be programmed (i.e., retain theinitial or reset state) should be equal to ⅔Vd. For example, in oneembodiment the driving voltage required to achieve acceptableperformance is 30V. If the driving voltage Vd=30V in the passive matrixdisplay illustrated in FIGS. 2 and 3A-3D, then the minimum thresholdvoltage that would be required to retain the initial state of cells W,X, and Z while changing the state of cell Y by applying a drivingvoltage of 30V to cell Y would be Vth=10V. Assuming B=30V, the solutionto the above equations is A=10V, C=0V and D=20V. By reference to FIGS. 2and 3A-3D, one can see that under these conditions the bias applied toeach of cells W, X, and Z would in fact be less than or equal to theminimum threshold voltage Vth=10V. For proper operation and performance,therefore, the cell threshold voltage must be quite high relative to thedriving voltage to be applied to change the electrophoretic display cellstate to avoid unwanted state changes or display performance degradationdue to cross bias.

As demonstrated above, the EPD cells must have a threshold voltagegreater than or equal to ⅓ of the driving voltage applied to change thecell display state in order for a passive matrix EPD to functionproperly. By material selection and structural design, a 5V to 50Vthreshold effect can be achieved. Assuming the EPD can operate at anenvironmental temperature up to 80° C. and the driving voltage is 30V,the EPD cell material and structural design can be selected such thatthe cells exhibit a threshold voltage of 10V at 80° C.

However, as noted above, the threshold voltage also varies withtemperature. In general, threshold voltage is low at high temperatureand threshold voltage is high at low temperature. FIG. 4 illustrates theinverse relationship between cell threshold voltage and temperature.

Controlling EPD cell temperature to maintain the cell threshold voltagewithin a desired range, regardless of the ambient temperature, isdisclosed. In one embodiment, a temperature control system is configuredto maintain the cell temperature in a range that results in thethreshold voltage being maintained at a value between ⅓ to ⅔ of thedriving voltage. Using the example illustrated in FIG. 4, in oneembodiment a heating pad and associated thermal control are provided tomaintain the cell temperature between 40° C. and 80° C., resulting inthe cell threshold voltage being maintained in the range of 10V to 20V(i.e., ⅓ to ⅔ of the 30V driving voltage in the illustrative exampledescribed above). In one embodiment, the EPD cell temperature ismaintained at or near a fixed temperature, e.g., 50° C.+/−5° C. Thetemperatures and voltages described above are presented for sake ofexample only, and the temperatures and voltages may be differentdepending on such factors as the cell structure, materials used, and therelationship between temperature and threshold voltage for a particularEPD cell.

FIG. 5A illustrates an EPD module structure with a heating pad used inone embodiment. The EPD module structure includes frame 502, clear frontplate 504, EPD panel 506, front air gap 508, metal plate 510, heatingpad 512, thermal barrier sheet 514, rear air gap 516, and solar cellpanel 518. Although shown in this embodiment, metal plate 510, solarcell panel 518, and thermal barrier sheet 514 may be excluded in otherembodiments.

Clear front plate 504 may be implemented using polycarbonate,plexi-glass, or another transparent thermal barrier material. In oneembodiment, EPD panel 506 is laminated to clear front plate 504. Heatingpad 512, which may be composed of an individual or multiple pads, can beplaced behind EPD panel 506 between front air gap 508 and heating pad512. Metal plate 510 can be laminated to the front of heating pad 512 toevenly distribute heat. Thermal barrier sheet 514, which may or may notbe present in other embodiments, can be laminated to the rear side ofheating pad 512 or the rear side of solar cell panel 518. Solar cellpanel 518 provides electric power for heating pad 512 and the controland driver circuit, as described below in connection with FIG. 11. Inother embodiments, sources of electric power other than a solar cellpanel may be used. Thermal barrier sheet 514 can be used to prevent heatloss from the rear side of the EPD module structure as well as thermalinsulation against an external (e.g., outdoors) environment. Rear airgap 516 between solar cell panel 518 and heating pad 512 can be includedto provide additional protection as an extra thermal barrier.

The EPD panel in FIGS. 5A, 5B and 5C comprises EPD cells which arefilled with EPD display media.

In one embodiment in which an EPD temperature above 10° C. is to bemaintained in an environment in which the temperature is −30° C., theEPD module structure is constructed using the following materials anddimensions:

Clear front plate: 0.25″ polycarbonate sheet

Frame: G10 fiberglass

Front air gap: 0.1″

Metal plate: 0.125″ aluminum

Heating pad: Floor heating roll, 10 W/ft²

Thermal barrier: none

Rear air gap: 0.2″

FIG. 5B illustrates an EPD module structure with a cooling pad used inone embodiment. Again, the EPD module structure includes frame 502,clear front plate 504, EPD panel 506, front air gap 508, metal plate510, thermal barrier sheet 514, rear air gap 516, and solar cell panel518. However, instead of heating pad 512 (FIG. 5A), a cooling pad 520 isprovided. Also, metal plate 510 and thermal barrier sheet 514 may beexcluded in other embodiments.

Constructed similarly to the EPD module structure in FIG. 5A, the EPDmodule structure includes cooling pad 520, which can be implemented asan individual pad or multiple pads or segments. Implementation ofcooling pad 520 can be provided using typical cooling elements such asrefrigerants or other coolants in both gas and liquid forms. Cooling pad520 can be placed behind EPD panel 506. Front air gap 508 can beincluded between EPD panel 506 and cooling pad 520. Optional metal plate510 may be laminated to the front of cooling pad 520 in order to evenlyabsorb heat. Optionally, thermal barrier sheet 514 laminated to the rearside of cooling pad 520 or the rear side of solar cell panel 518. Solarcell panel 518 provides electric power for cooling pad 520 and thecontrol and driver circuit, as described below in connection with FIG.11. In other embodiments, sources of electric power other than a solarcell panel may be used. Optional thermal barrier sheet 514, if included,prevents heat transfer from the rear side of the EPD module structure aswell as thermal insulation against an external (e.g., outdoors)environment. Rear air gap 516 may be placed between solar cell panel 518and cooling pad 520 to provide protection as an extra thermal barrier.

FIG. 5C illustrates an EPD module structure used in one embodiment witha thermal control pad for heating and cooling. As with FIGS. 5A and 5B,an EPD module structure is provided, including frame 502, clear frontplate 504, EPD panel 506, front air gap 508, optional metal plate 510,optional thermal barrier sheet 514, rear air gap 516, and solar cellpanel 518. However, instead of heating pad 512, a thermal control pad522 is provided. The solar cell panel, as stated above, may be replacedwith other sources of electric power.

Thermal control pad 522 provides temperature control and maintenance forthe EPD module structure. Implemented as either an individual pad ormultiple segments/pads, thermal control pad 522 can provide heating andcooling of EPD module structure, as needed. In one embodiment, thethermal control pad 522 is used to raise or lower the temperature of theEPD panel 506 to maintain the EPD cell threshold voltage at a desiredvalue or within a desired range of values. As stated above, the desiredrange of the threshold voltage for the EPD cells is equal to or greaterthan one third of a driving voltage used to drive the EPD cells to adesired display state.

The thermal control pad 522 may comprise a heating or cooling element.In one embodiment, the heating element may be a radiant heater or aconvection heater. The radiant heater or convection heater may be placedbehind the EPD panel. In another embodiment, the heating element may bea resistive heater. The resistive heater may be embedded in a thermallyconductive holder on which the EPD module structure is mounted. In afurther embodiment, the cooling element may be a refrigerant or coolantin either gas or liquid form.

FIG. 6A illustrates a thermal control pad used in one embodiment. Inthis embodiment, thermal control pad 600 comprises both heating andcooling elements. In this example, a striped configuration is created byintegrating column shaped heating pad segments 604 into a cooling pad602. In one embodiment, the heating pad segments 604 are placed on topof cooling pad 602. In other embodiments, the individual heating padsegments 604 may be placed under or within cooling pad 602. Otherarrangements can also be implemented.

FIG. 6B illustrates a thermal control pad used in one embodiment. Inthis embodiment, thermal control pad 610 is implemented in a“checkerboard” pattern. In one embodiment, cooling pad 612 is interwovenwith individual heating pads 614. In other embodiments, a single heatingpad can be interwoven with individual cooling pads. In still otherembodiments multiple individual heating pads can be interwove withmultiple individual cooling pads. Other embodiments of thermal controlpad 610 may be implemented using a variety of patterns of cooling andheating pads and is not limited to only those embodiments listed herein.

In one embodiment, the heating required to maintain the thresholdvoltage of the EPD cells at the desired level or within the desiredrange is provided at least in part by applying to an electrode of theEPD an AC signal that generates the required heat without interferingwith the operation of the EPD. In one embodiment, using this approacheliminates the need to include in the EPD a separate heating pad, suchas the heating pad 512 of FIG. 5A. A typical EPD is driven by applying aDC voltage to generate an electric field to cause the charged pigmentparticles to migrate to a desired position. In a typical EPD, theparticles on average do not move very fast, and may have a response timeon the order of 5 ms to 500 ms. As a result, when a fast switching ACsignal is applied, for example a square waveform at 10 kHz (100 μscycle), the particles cannot react to the fast switching waveform and asa result react only to the DC voltage of the waveform. In oneembodiment, this characteristic is used to generate heat by using anelectrode of the display as a heating element. Heat is generated byapplying to the electrode a fast switching AC signal selected so as togenerate the required heat as a product of the AC current passingthrough the electrode while not interfering with the operation of thedisplay by selecting a driving signal that has a DC voltage equal to theDC voltage required to be applied to the electrode under the applicableEPD driving scheme.

FIG. 7A illustrates a DC voltage 710 applied to an electrode of an EPDin one embodiment. In this example, a DC voltage of 20V is applied tothe electrode, such as may be required under the driving scheme of theEPD. In one embodiment, the electrode may be a thin film electrode.

FIG. 7B illustrates a driving signal 720 applied to an electrode layerin one embodiment to achieve the same effect on the EPD cells as the DCvoltage of FIG. 7A while also generating heat as a product of the ACcurrent passing through the electrode. In this example, a square wave at10 KHz (100 us cycle) has the same effect on the EPD cells as the DCvoltage shown in FIG. 7A.

FIG. 8A illustrates an EPD thin film heater in accordance with anembodiment. The thin film heater 800 comprises a common electrode 802.In one embodiment, the common electrode 802 comprises a common electrodeon the viewing side of a segment display. In one embodiment, the commonelectrode 802 comprises a common electrode on the viewing side of anactive matrix display. The thin film heater 800 comprises a firstcontact pad 804 connected electrically to one end of the commonelectrode 802 and a second contact pad 806 connected electrically to theopposite end of common electrode 802. In one embodiment, DC voltagesource 808 is configured to apply a DC voltage to common electrode 802by supplying DC voltage to the first contact pad 804 and one input ofadder circuit 811. The DC voltage supplied by DC voltage source 808 is aDC voltage applied to the common electrode 802 under the driving schemeused by an EPD in which the thin film heater 800 is used. The thin filmheater 800 also comprises an AC voltage source 810 configured to supplyan AC signal to another input of adder 811 when heating is desired. Whenheating is desired, the switch associated with AC voltage source 810 isin the position shown in FIG. 8A, i.e., the AC signal supplied by source810 is provided as an input to the adder 811. If heating is not desired,the switch associated with source 810 is switched to open the connectionbetween the source 810 and the adder 811 and instead connect the ACinput line to adder 811 to ground, as can be seen from FIG. 8A. When theswitch associated with AC source 810 is aligned to provide the AC signalsupplied by source 810 as input to adder 811, i.e., when heating isdesired, adder 811 adds the DC signal from DC voltage source 808 and theAC signal from 810 together and applies the combined signal to thesecond contact pad 806. Driver and control circuits not shown in FIG. 8Acontrol the operation of DC voltage source 808 to apply the DC voltagerequired for driving and the operation of AC voltage source 810 and itsassociated switch, when needed, to provide heating as required forproper operation of the EPD.

In one embodiment, the thin film heater 800 of FIG. 8A is used in an EPDin which the driving scheme requires that 10 V DC be applied to thecommon electrode for driving. FIG. 8B illustrates a DC voltage suppliedby DC voltage source 808 for driving in one such embodiment. The DCvoltage 812 may be applied to common electrode 802 alone for drivingwhen heating is not required. However, as described below, DC voltage812 may also be applied while applying an AC voltage to generate heatfor thermal control, as described above.

FIG. 8C illustrates an AC voltage applied to an EPD thin film heater inone embodiment. In this example, AC voltage 820 may be applied to commonelectrode 802 to enable thin film heater 800 to produce heat. In oneembodiment, the frequency of the AC signal 820 is such that the EPDcells of the display comprising the EPD thin film heater do not reactquickly enough to be affected materially by the AC signal. As a result,the cells do not change state (or remain in substantially the samestate) when the AC signal is applied for heating at a time when no DCvoltage is being applied to the common electrode for driving. Likewise,when the AC signal is applied to generate heat during driving the stablestate of the cells is determined by the DC driving voltage applied tothe common electrode and the voltages applied to other electrodesassociated with the cells (e.g., pixel or segment electrodes), and notby the AC signal being applied for heating.

FIG. 9A illustrates a passive matrix EPD electrode and heaterconfiguration 900 used in one embodiment. In the example shown, thepassive matrix EPD electrode and heater configuration 900 comprises aplurality of column electrodes 902 in a first electrode layer positionedon a first side of the EPD cell layer (not shown) and a plurality of rowelectrodes 904 in a second electrode layer positioned on a second sideof the EPD cell layer opposite the first side. In one embodiment, thecolumn electrodes 902 comprise transparent conductive material, such asITO or other transparent conductive material, and are located on theviewing side of the display. Row electrodes 904 may use thin filmconductive material that generates heat when current passes through theelectrode. Each of row electrodes 904 has a pair of contact pads 915-917at either end for making electrical contact. In one alternativeembodiment, each row electrode may have a contact pad on only one sideof the electrode. Each of row electrodes 904 is configured to enableapplication of one or the other of two DC voltages used in the drivingscheme. In the example shown in FIG. 9A, the DC voltages are supplied byDC voltage source 910 and DC voltage source 912. A voltage signal isprovided to a contact pad at one end of each row electrode via a switchassociated with DC supply lines 915-917, respectively, and to acorresponding contact pad at the opposite end of the row electrode via aconductive trace (not shown). Each of the DC supply lines 915-917 may beconnected via an associated switch with a selected one of the two DCvoltage sources 910 and 912. This enables the DC voltage provided by DCvoltage source 910 to be applied to the contact pads of the rowelectrode when the corresponding switch is aligned to DC voltage source910. Alternatively, the DC voltage provided by DC voltage source 912 canbe applied instead to the contact pads when the switches associated withDC supply lines 915-917 are aligned to DC voltage source 912. In thisexample, the DC voltage supplied by DC voltage source 910 is 10V DC andthe DC voltage supplied by DC voltage source 912 is 30V DC.

In this example, the configuration 900 is used in a passive matrix EPDin which 10 V DC is applied to non-scanning rows during driving and 30 VDC is applied to the scanning row(s). Each of the row electrodes 904also is configured to have applied to it, as desired, for heating an ACsignal supplied by AC voltage source 914. If heating is not desired,then the switch associated with AC voltage source 914 is aligned toconnect the AC supply lines to the adders 911 to ground (i.e., oppositethe position as shown in FIG. 9A), thus preventing the supply of an ACvoltage to adders 911 and, subsequently, row electrodes 904. Fornon-scanning rows of the passive matrix EPD comprising configuration900, the 10V DC voltage supplied by DC voltage source 910 is applied,and the AC signal supplied by AC voltage source 914 may also be appliedvia the adders 911 as desired to generate heat. For scanning rows, the30V DC voltage supplied by DC voltage source 912 is applied, and the ACsignal supplied by AC voltage source 914 may also be applied throughadder 911 as desired to generate heat. If heating is desired when thedisplay is not being scanned, the AC signal supplied by AC voltagesource 914 may be applied without also applying a DC voltage to the rowelectrodes 904. As in the embodiments described above in connection withFIG. 8A, the frequency of the AC signal supplied by AC voltage source914 is selected such that it does not affect the state of the EPD cellsmaterially and does not interfere materially with the driving of the EPDcells to desired stable states, which is determined instead by the DCvoltages applied to the row and column electrodes during driving.

The frequency of the AC signal used for heating must be selected basedon the characteristics of the EPD cells and associated structures. Inone embodiment, the frequency is selected based on simulations performedin which the response of the EPD cells to the application of differentAC waveforms is simulated and the AC waveform selected for heating isone to which the EPD cells did not react materially. In one alternativeapproach, a physical embodiment of the EPD cells and associatedstructures may be constructed and a variety of AC waveforms actuallyapplied to the physical embodiment to observe the response of the EPDcells to the various AC waveforms.

In the example shown in FIG. 9A, the rows associated with the top andbottom row electrodes 904 are not being scanned and are therefore shownas being connected to non-scanning row DC voltage source 910. The rowassociated with center row electrode 904 is being scanned and istherefore shown, in this example, as being connected to scanning row DCvoltage source 912. The AC voltage source 914 may be enabled to generateheating, if desired, or disabled when heating is not required.

FIG. 9B illustrates a 10V DC voltage 920 supplied by non-scanning row DCvoltage source 910 of FIG. 9A in one embodiment. In this example, 10V DCis the DC voltage that must be applied to non-scanning rows of thepassive matrix EPD in order to ensure that the cross bias applied tocells of the non-scanning rows is less than the threshold voltage.

FIG. 9C illustrates a 30V DC voltage 925 supplied by scanning row DCvoltage source 912 of FIG. 9A in one embodiment. In this example, 30V DCis applied to the scanning row, such as the row associated with centerrow electrode 904 of FIG. 9A, for driving.

FIG. 9D illustrates an AC voltage 930 supplied by the AC voltage source914 of FIG. 9A in one embodiment. AC voltage 930 varies between 10V and−10V and, as described above, switches between the two levels with afrequency selected such that the EPD cells do not have time to reactmaterially to the AC signal 930.

For an EPD, (e.g., a passive matrix EPD) similar configurations to thosedescribed above can be applied. In other embodiments, differentconfigurations can be implemented including variations to cell andelectrode matrices, AC/DC voltages, contact pads, electrode materials aswell as other aspects of the thin film heater.

Significant advantage can occur by using one or more electrodes of anEPD to generate heat, as described above. This eliminates additionalcosts for an outside heating device, or for incorporating additionalmaterials and structures into the EPD to provide for heating, andimproves optical performance of the display by reducing the obstructionsto light emitting from an EPD.

While the thin film heaters of FIGS. 8A-9D are described in connectionwith an EPD, those of ordinary skill in the art will recognize that thetechniques described herein may be applied as well to other types ofdevice in which an AC signal may be applied to an existing electrode orother conductive structure to generate heat, as desired, withoutinterfering materially with the normal operation of the device and inparticular with the primary function of the structure used for heating.

FIG. 10A is a state diagram illustrating a thermal control algorithm1000 used in one embodiment. In one embodiment, the algorithm shown inFIG. 10A is used in connection with a thermal control system comprisinga thermal control pad capable of either heating or cooling the EPD, asneeded, such as the thermal control pad 522 of FIG. 5C. The EPD thermalcontrol system, if not heating or cooling, may be in a standby state1002 in which heating and cooling pads are not actively heating orcooling the EPD. In one embodiment, the thermal control system isdeactivated when in standby state 1002. In one embodiment, the thermalcontrol system is not fully deactivated but instead is running in astandby mode when in standby state 1002.

If when the thermal control system is in the standby state 1002 the EPDdisplay media temperature drops below a heat activation thresholdtemperature T_(H1), the thermal control system transitions asillustrated in FIG. 10A to a “heating” state 1004 in which the heatingfunctionality of the thermal control pad is activated to provide heatingto the EPD display media. If, when the thermal control system is in the“heating” state 1004, the EPD display media temperature rises above a“deactivate heat” threshold temperature T_(H2), the heatingfunctionality of the thermal control pad is deactivated and the systemreturns to the standby state 1002. In one embodiment, the deactivateheat threshold temperature is different from the activate heat thresholdtemperature. In one embodiment, the activate threshold temperatureT_(H1) is less than the deactivate heat threshold temperature T_(H2). Inother embodiments, the activate threshold temperature, T_(H1), may bethe same as the deactivate heat threshold temperature, T_(H2). If thesystem is in the standby state 1002 and the temperature rises above an“activate cooling” temperature T_(C1), the thermal control systemtransitions to a “cooling” state 1006. In one embodiment, the coolingfunctionality of the thermal control pad is used to cool the EPD displaymedia when the thermal control system is in cooling state 1006. If whenthe system is in cooling state 1006 the temperature drops below a“deactivate cooling” threshold temperature, T_(C2), the systemtransitions to the standby state 1002 and the cooling functionality ofthe thermal control pad is deactivated. In one embodiment, the activatecooling threshold temperature, T_(C1), may be different than thedeactivate cooling threshold temperature, T_(C2). In one embodiment, theactivate cooling threshold, T_(C1), is greater than the deactivatecooling threshold, T_(C2). In one alternative embodiment, the activatecooling threshold temperature, T_(C1), may be the same as the deactivatecooling threshold temperature, T_(C2).

FIG. 10B is a state diagram illustrating a thermal control algorithm1010 used in one embodiment. In one embodiment, the algorithm 1010 isimplemented to control a thermal control system that comprises a heatingpad, such as the heating pad 512 of FIG. 5A. The EPD thermal controlsystem, if not heating, may be in a standby state 1012 in which theheating pads is not actively heating the EPD. In one embodiment, thethermal control system is deactivated when in standby state 1012. In oneembodiment, the thermal control system is not fully deactivated butinstead is running in a standby mode when in standby state 1012.

If when the thermal control system is in the standby state 1012 the EPDdisplay media temperature drops below a heat activation thresholdtemperature T_(H1), the thermal control system transitions asillustrated in FIG. 10B to a “heating” state 1014 in which the heatingpad is activated to provide heating to the EPD display media. If whenthe thermal control system is in the “heating” state 1014 the EPDdisplay media temperature rises above a “deactivate heat” thresholdtemperature, T_(H2), the heating pad is deactivated and the systemreturns to the standby state 1012. In one embodiment, the deactivateheat threshold temperature, T_(H2), is different than the activate heatthreshold temperature, T_(H1). In one alternative embodiment, thedeactivate heat threshold, T_(H2) may be the same as the activate heatthreshold temperature, T_(H1).

FIG. 10C is a state diagram 1020 illustrating a thermal controlalgorithm 1020 used in one embodiment. In one embodiment, the algorithm1020 is implemented to control a thermal control system that comprises acooling pad, such as cooling pad 520 of FIG. 5B. The EPD thermal controlsystem, if not cooling, may be in a standby state 1022 in which thecooling pad is not actively cooling the EPD. In one embodiment, thethermal control system is deactivated when in standby state 1022. In oneembodiment, the thermal control system is not fully deactivated butinstead is running in a standby mode when in standby state 1022. If whenthe system is in the standby state 1022 the temperature rises above an“activate cooling” temperature T_(C1), the thermal control systemtransitions to a “cooling” state 1024. In one embodiment, the coolingpad is used to cool the EPD display media when the thermal controlsystem is in activate cooling state 1024. If when the system is in“cooling” state 1024 the temperature drops below a “deactivate cooling”threshold temperature, T_(C2), the system transitions to the standbystate 1022 and the cooling pad is deactivated. In one embodiment, theactivate cooling threshold, T_(C1), is greater than the deactivatecooling threshold, T_(C2). In one embodiment, the “activate cooling”threshold temperature, T_(C1), may be the same as the “deactivatecooling” threshold temperature, T_(C2).

FIG. 11 illustrates an EPD thermal control system 1100 used in oneembodiment. Thermal control pad 1102 receives driving voltages fromthermal control pad driver 1104. Overall control of thermal controlsystem 1100 is provided by thermal control logic module 1106, whichreceives temperature signals from sensor 1108. In one embodiment, thesensor 1108 is configured to sense the ambient temperature and thethermal control logic 1106 controls the thermal control pad drivercircuit as required to maintain the EPD display media temperature at thedesired level based on the ambient temperature. In one embodiment, thesensor 1108 is configured to sense the temperature of the EPD displaymedia. In one embodiment, the sensor 1108 comprises a temperature sensorpositioned in or near the EPD cell media. In one embodiment, the sensor1108 comprises a thermocouple embedded in the EPD display media. In oneembodiment, the sensor 1108 may comprise multiple sensors configured tosense parameters other than environmental and/or display mediatemperature, such as humidity or other environmental conditions.

In one embodiment, the logic implemented on thermal control logic 1106comprises one of the algorithms illustrated in FIG. 10A, 10B, or 10C,depending on the type of thermal control pad included in the EPD (i.e.,heating/cooling, heating, or cooling).

Although the foregoing embodiments have been described in some detailfor purposes of clarity of understanding, the invention is not limitedto the details provided. There are many alternative ways of implementingthe invention. The disclosed embodiments are illustrative and notrestrictive.

1. An EPD module structure, comprising: i) an EPD panel comprising EPDcells filled with EPD display media; and ii) a thermal control pad whichis capable of controlling the temperature associated with the EPDdisplay media to ensure that the threshold voltage of the EPD cells isequal to or greater than one third of a driving voltage used to drivethe EPD cells to a desired display state.
 2. The EPD module structure ofclaim 1, further comprising a clear front plate.
 3. The EPD modulestructure of claim 1, further comprising a metal plate.
 4. The EPDmodule structure of claim 1 further comprising an air gap.
 5. The EPDmodule structure of claim 1 further comprising a thermal barrier sheet.6. The EPD module structure of claim 1 further comprising an electricpower source.
 7. The EPD module structure of claim 6 wherein saidelectric power source is a solar cell panel.
 8. The EPD module structureof claim 1 wherein said thermal control pad comprises a heating element.9. The EPD module structure of claim 8 wherein said heating element is aradiant heater.
 10. The EPD module structure of claim 8 wherein saidheating element is a convection heater.
 11. The EPD module structure ofclaim 8 wherein said heating element is a resistive heater.
 12. The EPDmodule structure of claim 1 wherein said thermal control pad comprises acooling element.
 13. The EPD module structure of claim 12 wherein thecooling element is a refrigerant or coolant.
 14. The EPD modulestructure of claim 13 wherein said refrigerant or coolant is in the formof a gas.
 15. The EPD module structure of claim 13 wherein saidrefrigerant or coolant is in the form of a liquid.